HIC module hybrid IC
Introducing a composite circuit component that modularizes circuit blocks into a single functioning device.
The "HIC Module Hybrid IC" is a composite circuit product that forms circuits by mounting various chip components on ceramic substrates and glass epoxy substrates, functioning as a single module. It enables miniaturization, reduction of mounting costs, black-boxing of circuits, and rationalization of component management. Additionally, it can be customized according to the user's preferences. 【Benefits of Modularization】 ■ Miniaturization ■ Reduction of mounting costs ■ Design changes ■ Black-boxing of confidential circuits ■ Rationalization of component management *For more details, please refer to the PDF materials or feel free to contact us.
- Company：福島双羽電機 東京営業所
- Price：Other
