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Hybrid IC Product List and Ranking from 5 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Hybrid IC Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. IAM Electronics Co., Ltd. Nagano//Industrial Electrical Equipment
  2. 光山電気工業 拡販推進 Gunma//Industrial Electrical Equipment
  3. 愛恵電子 Aichi//Electronic Components and Semiconductors
  4. 4 福島双羽電機 東京営業所 Tokyo//others
  5. 5 加賀FEI Kanagawa//Electronic Components and Semiconductors
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Hybrid IC Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Hybrid IC IAM Electronics Co., Ltd.
  2. Hybrid I.C [Achieving optimal circuit configuration and external structure!] 光山電気工業 拡販推進
  3. Hybrid IC (HIC) implementation 愛恵電子
  4. 4 Thick-film hybrid IC IAM Electronics Co., Ltd.
  5. 5 HIC module hybrid IC 福島双羽電機 東京営業所

Hybrid IC Product List

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Bluetooth 5.0 Hybrid IC 'ES2832AA2'

Bluetooth 5.0 Hybrid IC 'ES2832AA2'

Hybrid integrated circuit using silicon monolithic semiconductors! Wireless communication module.

We would like to introduce our hybrid IC for Bluetooth 5.0, the 'ES2832AA2'. This is a hybrid integrated circuit using silicon monolithic semiconductors. The product complies with the RoHS directive regarding the presence of environmental substances. It is suitable for applications such as IoT devices, health and fitness equipment, sensors, and toys. Please feel free to contact us if you have any inquiries. 【Specifications (partial)】 ■ User Code: nRF52832-CIAA-G-R ■ Certification Model: ES2832 ■ Chip: Nordic nRF52832 (512KB Flash, 64KB RAM) ■ Function: Wireless communication module (compliant with Bluetooth 5.0) *For more details, please download the PDF or feel free to contact us.

  • Dedicated IC

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Thick-film hybrid IC

Thick-film hybrid IC

No troublesome post-adjustments needed! You can print resistors on a ceramic substrate!

The "thick-film hybrid IC" uses a ceramic substrate, which can suppress the temperature rise of electronic components. The pattern is fired onto the ceramic substrate at approximately 800°C. The heat resistance of the ceramic substrate is higher than that of PWB due to high-temperature processing, ensuring reliability. In addition, we also handle "hybrid ICs" that can reduce total manufacturing costs through modularization. 【Features】 ■ Excellent heat dissipation ■ Miniaturization through printed resistance ■ Function trimming ■ High reliability ■ Available in SIP type and DIP type *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board

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Hybrid IC

Hybrid IC

Simplifying and miniaturizing circuit boards without the hassle of parts procurement or equipment. Capable of providing custom products with short lead times and low costs.

Our company manufactures "Hybrid ICs" that integrate circuit design technology, assembly technology, and measurement technology based on years of experience in thick film manufacturing. This allows for simplification and miniaturization of circuit boards without the hassle of component procurement or equipment. It also contributes to reduced development time and lower management costs. We also support production using alumina ceramic substrates, which excel in heat dissipation and heat resistance. We welcome inquiries regarding integration density, usage conditions, pricing, and delivery times. 【Features】 ■ Simplification and miniaturization of circuit boards through modularization ■ High reliability due to low thermal expansion and high thermal conductivity of alumina substrates ■ Reduction of management costs through simplified component management ■ Adjustments through operational trimming ■ Custom design enabling flexible circuit design *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • Other electronic parts

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HIC module hybrid IC

HIC module hybrid IC

Introducing a composite circuit component that modularizes circuit blocks into a single functioning device.

The "HIC Module Hybrid IC" is a composite circuit product that forms circuits by mounting various chip components on ceramic substrates and glass epoxy substrates, functioning as a single module. It enables miniaturization, reduction of mounting costs, black-boxing of circuits, and rationalization of component management. Additionally, it can be customized according to the user's preferences. 【Benefits of Modularization】 ■ Miniaturization ■ Reduction of mounting costs ■ Design changes ■ Black-boxing of confidential circuits ■ Rationalization of component management *For more details, please refer to the PDF materials or feel free to contact us.

  • Other electronic parts

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Hybrid I.C [Achieving optimal circuit configuration and external structure!]

Hybrid I.C [Achieving optimal circuit configuration and external structure!]

Custom-designed ICs that achieve optimal circuit configuration and external structure! Contributing to the miniaturization of your products!

The "Hybrid I.C (H.I.C)" is a custom-designed IC that achieves the optimal circuit configuration and external structure according to customer requirements. Our company supports various substrates, including ceramic substrates, glass epoxy boards, and flexible boards. We contribute to the miniaturization of our customers' products through a wide range of mounting technologies, such as thick film printing and bare chip mounting. Furthermore, we provide production support with our long-established manufacturing quality, from ultra-small substrates to high-density assembly boards. 【Features】 ■ Custom specifications available ■ Contributes to miniaturization ■ Supports a wide range of mounting technologies *For more details, please request materials or view the PDF data available for download.

  • Other electronic parts
  • ASIC
  • Dedicated IC

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Hybrid IC (HIC) implementation

Hybrid IC (HIC) implementation

We will produce hybrid ICs (HIC) in a consistent manner.

Hybrid ICs are constructed by combining components such as circuits, resistors, and capacitors with one or more integrated circuits. They offer high design flexibility and are suitable for designing high power, high voltage, and high frequency circuits. Our company provides a comprehensive service for hybrid ICs (HIC), covering everything from substrate mounting to automatic lead frame attachment, molding, and silk printing. For molding, we use epoxy paint for electronics, which is applied by machine, resulting in a clean finish. In silk printing, we use a pad transfer method with machines, allowing for high-quality printing even on uneven surfaces that are impossible to achieve with inkjet methods. Since our founding, we have been mass-producing a wide variety of hybrid ICs (HIC) and delivering high-quality products that our customers can trust.

  • Circuit board design and manufacturing
  • EMS
  • Processing Contract

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